Navid Asadi

Packaging Part 19 6 - Innovations in Active Cooling Technologies for Semiconductor Packages

Packaging Part 19 5 - Introduction to Thermal Management in Semiconductor Packaging

Packaging Part 16 4 - Introduction to Optical Transceivers

Packaging Part 19 3 - Introduction to Thermal Management in Semiconductor Packaging

Packaging Part 19 4 - Advanced Thermal Interface Materials (TIMs) in Packaging

Packaging Part 22 - Flexible Electronics

PAckaging Part 16 2 - Silicon Photonics & Global Indsutry Dynamics

Packaging Part 15 3 - Quantum MEMS

Packaging Part 19 2 - Thermal Challenges in Advanced Packaging

Packaging Part 20 - Package Substrates

Semiconductor Part 1 - Fabrication

Packaging Part 19 1 - Thermal Measurements in Advanced Packaging

Packaging Part 18 - Memory Devices Packaging and Challenges

Packaging Part 15 1 - Nanoelectromechanical Systems(NEMS) Devices

Packaging part 17 - AI and Packaging

Packaging Part 16 1 - Overview of Silicon Photonics

Packaging Part 15 2 - Packaging for MEMS Devices

Packaging Part 14 - AiP Deep Dive

Packaging Part 13 - Antenna in Package (AiP)

SCAN Lab Tour - LINK TO THE LAB VR TOUR IN THE DESCRIPION

Packaging Part 12 - Hybrid Bonding 1

THz for Physical Assurance

Research Video Making Process

Packaging Part 11 - HI Integrated Circuit Co Design

THz for Electronics Physical Assurance

Packaging Part 16 3 - Integrated Silicon Photonics

Packaging Part 10 - Heterogeneous Integration Materials

Packaging part 9 - Heterogeneous Integration Interconnections

IC Assurance - Intelligent Physical Inspection for Counterfeit IC Detection

Packaging Part 8 - Failure Analysis for IC Packaging