Paul Franzon

System Verilog forDesign

System Verilog forDesign
How to succeed doing a PhD in Electrical and Computer Engineering

How to succeed doing a PhD in Electrical and Computer Engineering
Implementation of a Chaotic Neural Network Reservoir on a TSV Stacked 3D CyclicNeural Network IC

Implementation of a Chaotic Neural Network Reservoir on a TSV Stacked 3D CyclicNeural Network IC
Design for a 3D Stacked Neural Network Circuit with Cyclic Analog Computing, Koji Kiyoyama

Design for a 3D Stacked Neural Network Circuit with Cyclic Analog Computing, Koji Kiyoyama
Cu-to-Cu Direct Bonding Through Highly Oriented Enlarged Cu Grains for Advanced 3D-LSI Applications

Cu-to-Cu Direct Bonding Through Highly Oriented Enlarged Cu Grains for Advanced 3D-LSI Applications
Proposed Standardization of Chiplet Models for Heterogeneous Integration, Anthony Mastroianni

Proposed Standardization of Chiplet Models for Heterogeneous Integration, Anthony Mastroianni
Thermal Reliability Considerations of Resistive Synaptic Devices for 3D Compute InMemory System Perf

Thermal Reliability Considerations of Resistive Synaptic Devices for 3D Compute InMemory System Perf
Electrical and Performance Advantages of Advanced Monolithic Cooling for 2.5DHeterogeneous ICs

Electrical and Performance Advantages of Advanced Monolithic Cooling for 2.5DHeterogeneous ICs
Multi-ANN Embedded system based on a custom 3D-DRAM, Paul Franzon NCSU

Multi-ANN Embedded system based on a custom 3D-DRAM, Paul Franzon NCSU
3D DRAM Accelerators Review, Prasanth Ravichandiaran, NCSU

3D DRAM Accelerators Review, Prasanth Ravichandiaran, NCSU
Heterogeneous integration: The devil is in the details, invited talk, Alan Huffman, Micross

Heterogeneous integration: The devil is in the details, invited talk, Alan Huffman, Micross
Miniature heterogeneous microLED packages for high performance display systems, Chris Bower Xdisplay

Miniature heterogeneous microLED packages for high performance display systems, Chris Bower Xdisplay
Packaging challenges in 100-300 GHz wireless, invited talk, Mark Rodwell, UCSB

Packaging challenges in 100-300 GHz wireless, invited talk, Mark Rodwell, UCSB
3D IC advanced technologies for smart imager, invited talk, Pascal Vivet, CEA-LIST

3D IC advanced technologies for smart imager, invited talk, Pascal Vivet, CEA-LIST
Hybrid Bonding Technology Enabliing High Performance Computing, Gill Fountain, Xperi

Hybrid Bonding Technology Enabliing High Performance Computing, Gill Fountain, Xperi
3D Integration -- trends, challenges and opportunities, Madhavan Swaminathan, GeorgiaTech

3D Integration -- trends, challenges and opportunities, Madhavan Swaminathan, GeorgiaTech
2.5D and 3DIC Technology and Design, Tutorial, Paul Franzon, NC State University

2.5D and 3DIC Technology and Design, Tutorial, Paul Franzon, NC State University
Advanced Packaging Enablement for Compute, Keynote, Robert Patti, NHanced Semiconductor

Advanced Packaging Enablement for Compute, Keynote, Robert Patti, NHanced Semiconductor
3DIC challenges panel, organized and moderated by Jan Vardaman of Techsearch

3DIC challenges panel, organized and moderated by Jan Vardaman of Techsearch
3D for More Moore, Plenary, Mustafa Badaroglu, Qualcomm

3D for More Moore, Plenary, Mustafa Badaroglu, Qualcomm
Future Challenges for on package interconnects, Plenary, Debendra Das Sharma, Intel

Future Challenges for on package interconnects, Plenary, Debendra Das Sharma, Intel
Introduction2v2

Introduction2v2
Introduction1v2

Introduction1v2
Revision

Revision
Reset

Reset
Do a PhD in ECE at NC State University

Do a PhD in ECE at NC State University
Digital Logic Basics Review - 3. Computer Arithmetic

Digital Logic Basics Review - 3. Computer Arithmetic
Digital Logic Basics Review - Sequential Logic

Digital Logic Basics Review - Sequential Logic
Digital Logic Basics Review 1. Combinational Logic

Digital Logic Basics Review 1. Combinational Logic
Doing an MS degree in Electrical and Computer Engineering at NC State University

Doing an MS degree in Electrical and Computer Engineering at NC State University