Henkel Low Pressure Molding Material for Electronics | Cable and Connectors | TECHNOMELT

Electronic components need to be protected against moisture, chemical exposure and high temperatures, but standard production cycles with bonding and encapsulation takes time and have design limitation. To know more please visit : https://bit.ly/3tuqvA8

TECHNOMELT® low pressure molding material solutions form Henkel offer streamlined processing and excellent protection for Medical, Electronic Components, Power & Industrial Automation, HVAC and Lighting applications. The simplicity of these products is their advantage: the entire TECHNOMELT® operation takes place at low pressure, cycle time is short, and fine or fragile circuitry is not damaged. For these reasons, TECHNOMELT® is increasingly being chosen as an alternative to encapsulating processes (e.g. potting) as well as conventional plastic housings.

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