Don’t Let Ground Bounce Ruin your Day June 17 2020
Автор: Washington Laboratories
Загружено: 2020-06-26
Просмотров: 1438
Ground bounce is a common problem in packages, connectors and circuit boards. And it gets worse with shorter rise times. This insidious problem can cause enough cross talk to break almost any product.
In this webinar we look at the principles behind the root cause of ground bounce, how we can measure the ground bounce in your system; and based on the root cause, how we can design ground bounce out of your next product.
Presenter: Dr. Eric Bogatin, Signal Integrity Evangelist Teledyne LeCroy
Eric Bogatin is currently a Signal Integrity Evangelist with Teledyne LeCroy and the Dean of the Teledyne LeCroy Signal Integrity Academy, at www.beTheSignal.com. Additionally, he is an Adjunct Professor at the University of Colorado - Boulder in the ECEE dept, and technical editor of the Signal Integrity Journal.
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