SEMICON West 2025 Nordson Test & Inspection Video Interview
Автор: Semiconductor Digest
Загружено: 2025-10-31
Просмотров: 92
At SEMICON West 2025, Editor-in-Chief Pete Singer caught up with Nordson Test & Inspection’s Carla Furanna, Global Marketing and Market Development, and Ben Peecock, Senior Director, Business Development, X-Ray & Test Systems, to talk about Nordson's WaferSense® semiconductor sensors, Quadra Pro™ Manual X-Ray System (MXI), Gen 7™ Acoustic Micro Imaging (AMI) system and 4800 Integra Bond Tester. Nordson’s new Auto Centering System™ (ACS), is an extension of the wireless, WaferSense® sensor portfolio designed for capturing and analyzing real-time data for effective semiconductor tool set-up and maintenance. The wafer-shaped ACS “sees” inside equipment to capture dimensional offset data (x,y and z) to quickly center wafer transfer positions. The recently launched next-generation Auto Gapping Sensor™ (AGS2) speeds non-contact gap measurements and parallelism adjustments under vacuum, improving uniformity, tool availability and repeatability in a thinner and lighter form factor. The Gen7 AMI system powered by C-SAM technology, provides fast and highly accurate inspection for detecting delamination and voiding with the most sophisticated microscope.
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