Liquid Metal Failure: Improper Removal Caused LM to Seep Under CPU | Geld Technologies

This video documents a real case of improper liquid metal (LM) removal handled prior to arriving at Geld Technologies.

As shown, the liquid metal has migrated underneath the CPU, which is a serious red flag and indicates incorrect removal technique. When liquid metal is not properly controlled during removal, it can flow under the CPU package and into surrounding areas.

⚠️ Why this is dangerous:
Liquid metal is electrically conductive. Once it migrates under the CPU, it can cause:

Short circuits

Corrosion over time

Permanent CPU or motherboard damage

This typically happens due to:

Poor removal technique

Excessive pressure during cleaning

No masking or insulation of surrounding components

Lack of experience handling liquid metal

🔧 Professional note from Geld Technologies:
Liquid metal should only be applied and removed by trained technicians using proper insulation, controlled absorption, and inspection methods. Improper handling can easily turn a thermal upgrade into a board-level failure.

This video is shared for educational purposes to help users and technicians understand the risks involved.

📍 If you’re unsure—don’t DIY liquid metal.
Have it handled by professionals.

📞 Need Professional Help?

If your device has liquid metal issues, overheating, or suspected board damage:

👉 WhatsApp: https://wa.me/60166669438

👉 Website: https://www.computerrepair.com.my

📍 Geld Technologies – Professional Laptop & Motherboard Repair (Malaysia)
Over a decade of experience handling advanced thermal and board-level repairs.