2021 TAIROS HIWIN Equipment Front End Module (EFEM) - 晶圓移載系統 (EFEM)

晶圓移載系統（EFEM）- 半導體自動化的解決方案
Equipment Front End Module（EFEM ）- Solution for Semiconductor Automation

展機說明 :
HIWIN EFEM打造半導體產業自動化：提供客製化服務，彈性選擇晶圓機器人與周邊配件，幫助您建構最具效率及競爭力的生產設備。透過有效控制發塵量及靜電抑制，避免晶圓在傳送過程中受到汙染，影響產品良率。HIWIN Wafer Robot能快速、安全及精準地將晶圓傳送到指定位置，實現半導體自動化目標。

展機特色 :
➣ 滿足市場多元需求:半導體、光學檢測、太陽能、LED產業等。
➣ 提供彈性客製:模組化設計、不同類型、尺寸、1-8個晶圓載入/出埠彈性選擇，配合產線配置，快速提供最佳模組解決方案。
➣ 國際安規品質認證:支援SECS/GEN通訊架構，國際半導體設備SEMIS2認證，潔淨度Class1，符合ROHS規範。

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Description :
HIWIN EFEM provides the clean environment required during the conveying process. Through effective control of dust generation and static suppression, the amount of pollution will not be affected during the conveying process and affect the product yield. In this way, the HIWIN Wafer Robot can quickly, safely and infantry be transported to the designated location, achieving the goal of robot automation.

Feature :
➣ Meet the diverse needs of the market: semiconductor, optical inspection, solar energy, LED industry, etc.
➣ Provide flexible customization: modular design, different types, sizes, 1-8 wafer loading/unloading flexible options, and production line configuration to provide the best module solution.
➣ International safety standard quality certification: support SECS/GEN communication architecture, international semiconductor equipment SEMIS2 certification, cleanliness Class1, in line with ROHS

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