Printed circuit board production, part 3: RIGID.flex Continued

We continue our series "PCB Production", building on the webinar "Basics of PCB Production, Part 1" and “PCB Production, part 2: RIGID.flex”.
The second part on RIGID.flex technology is intended as an introduction to the production of rigid-flex PCBs and covers constructions with internal flex layers.
And of course, a rigid-flex printed circuit board is also a very complex construct, produced by a large number of sequential processes from a wide variety of materials, which must also be suitable for further processing and the planned application.
Understanding this helps in PCB design to be able to successfully implement the requirements from the functional specification in the design and the knowledge equally helps in communicating with the PCB manufacturer. This webinar series teaches the basics of PCB production and is aimed at PCB designers, buyers, electronics developers and students.

In this webinar you will learn more about
The difference in RIGID.flex between buildups with inner and outer flex layers
The manufacturing and production processes for rigid-flex with internal flex layers
Our advantageous standard stackups
Application examples

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Timestamps:
00:00 Introduction
01:22 Review Webinar PCB Production Part 2
02:11 Application Examples
12:20 Production Processes