Core i3 i5 i7 i9 কিভাবে Categorize করা হয়? Microchip Manufacturing Process Part II

We often hear terms like Intel Core i3, i5, i7, and i9 — but did you know they all come from the same silicon wafer? They're actually categorized at the very end of the manufacturing process, during what's called the Binning Process.

In this video, we’ll walk you through the key post-lithography steps in microchip manufacturing — all the way to how processors are finally labeled as i3, i5, i7, or i9.

After lithography, the wafer goes through:

🔹 Etching – unwanted material is removed to define circuit patterns.
🔹 Ion Implantation – high-speed ions (like Boron or Phosphorus) are fired into the wafer to make it electrically conductive. This turns normal silicon into N-type or P-type semiconductors, which are crucial for making transistors.
🔹 Annealing – the wafer is heated to repair crystal damage caused by ion implantation.

Next, Thin Film Deposition adds ultra-thin layers that make up transistors, wires, and capacitors. This is done using PVD or CVD machines.

Then comes CMP (Chemical Mechanical Planarization) to polish each layer to atomic smoothness — crucial for packing billions of components into a tiny chip.

After that, Interconnect Formation connects all components with metal wires (usually copper or tungsten).

Then it's time for Testing and Packaging. Each chip on the wafer is tested with tiny probes to check logic, power, and performance. Good chips are cut out (diced), packaged, and get ready for binning.

Now comes the final step: Binning.
Even though all chips are based on the same design, due to tiny defects or electrical variation, their performance differs. That’s why:

Chips that perform the best with all cores active become Core i9

Slightly weaker ones become i7

More disabled cores or lower speeds = i5 or i3

Faulty cores are disabled using laser fusing or firmware locks, and the chip is labeled accordingly.

So, Core i3 to i9 aren't different chips — they’re the same chip, just ranked by performance.

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