Mobile Chip Reballing – How to Reball with Stencil & Solder Paste!

Learn how to reball mobile chips using a stencil and solder paste in this step-by-step tutorial. Perfect for Samsung and other smartphone repairs, this method ensures precise solder ball placement and a reliable reflow.

📌 What you’ll learn:

Tools and materials needed: stencil, solder paste, reflow station

Preparing the chip and PCB for reballing

Applying solder paste using the stencil

How to reflow the chip correctly

Cleaning and final inspection tips

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