Automated MicroLED ACF Bonding Machine

Micron-level ACF Vacuum Bonding Machine for Micro LED.
Laser Cutting ACF Range: any shape and size within 360mm*370mm
Ultra Cutting Precision≤10μm (currently 4.6μm)
CCD Locating System Precision ≤30μm
Fixation Method: vacuum adsorption
ACF Tear-off Paper Method: automatic tear-off paper through mechanical claws
For more details, feel free to contact us. We are the developer and manufacturer.
Tel./WhatsApp: +86 15316363017
Email: [email protected]
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