Ultrasonic Grinding of SiC (Silicon Carbide) : (Helical) Circular Ramping｜Hantop Intelligence Tech.

Ultrasonic Grinding of SiC (Silicon Carbide) : (Helical) Circular Ramping｜Hantop Intelligence Tech.
HIT utilized ultrasonic machining module for (helical) circular ramping of SiC (silicon carbide). The high frequency micro-vibration helped reduce cutting forces, which helped improve surface roughness by 72%. Ultrasonic-assisted grinding mechanism also brought better particle flushing, preventing the tool from ceramic dust accumulation.
💡Learn more about HIT Ultrasonic-assisted Machining at https://www.hit-tw.com/

SiC (Silicon Carbide) has a Mohs hardness rating of 9, and it is an exceptional material choice for high-precision mechanical components.

This material bears excellent chemical and mechanical stability with high-temperature and thermal shock resistance, which also makes it an ideal material for semiconductor fabrication commodities, such as SiC substrates, SiC wafer susceptors, SiC wafer carriers, SiC E-chucks, etc.

Within the MOCVD reactor chamber, SiC wafer susceptors are used to carry the substrates. The susceptors absorb thermal energy to help with film growth. Therefore, the product quality of susceptors will have direct influence on the quality of semiconductor epilayer.

However, due to the high hardness and brittleness of silicon carbide, the risk of (helical) circular ramping SiC resides in poor surface quality with massive tool marks. If the grinding forces are not well-controlled (due to serious cumulative ceramic particles stuck in the pores of grinding tool) during the process, it would take more time to do tool dressing in order to restore the grinding ability of the tool.

HIT ultrasonic-assisted (helical) circular ramping of SiC (silicon carbide) helped reduce grinding forces. This helped improve the surface roughness (Sa) by 72% with mitigating tool marks on the surface. The tool constantly lifting from workpiece allowed for easier inflow of cutting fluid, which brought better particle flushing and prevented the tool from massive ceramic dust accumulation.
💡Learn more about Ultrasonic Machining on SiC case at https://www.hit-tw.com/advantagedetai...

In addition to SiC (silicon carbide), HIT also applies the ultrasonic-assisted machining technology to a wide range of demanding materials, including technical ceramic (aluminum oxide, zirconium dioxide), quartz glass, sapphire, tungsten carbide, mould/tool steel, alloy steel, titanium alloys, and even composites.
💡Learn more HIT's application cases at https://www.hit-tw.com/advantage.aspx


-
Hantop Intelligence Tech.
✨Solution Provider of Advanced-Material Machining Technology & Smart Automation Modules✨
☎️ +886-4-2285-0838
📧 [email protected]
Feel free to contact us at https://www.hit-tw.com/contact.aspx

SHARE🔗｜LIKE👍｜SUBSCRIBE📌｜CLICK ON🔔

👉Follow HIT on Facebook :   / hantopintelligence  
👉Follow HIT on LinkedIn :   / hantopintelligence