运用PowerDC技术进行多封装、PCB电热协同仿真
Автор: Cadence Design Systems
Загружено: 2018-09-24
Просмотров: 2065
Cadence Sigtiry PowerDC 可使用户根据电子产品PCB所在区域的工作温度来预测正确的直流电压降,本视频将就此展示如何使用PowerDC进行多封装、PCB的电/热协同仿真。
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Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence® software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s Intelligent System Design strategy helps customers develop differentiated products—from chips to boards to intelligent systems—in mobile, consumer, cloud data center, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For. Learn more at www.cadence.com.

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