IC Packaging - More Than an Enclosure
Автор: EMA Design Automation
Загружено: 2020-12-11
Просмотров: 8650
Although the IC package design is the last stage of a components fabrication, the correct design is essential to its performance. In this webinar, our experts will discuss key features to consider when designing your IC package, common challenges you may face, and demonstrate how complete chip to package to board flow can make the design process easier. Join us to learn why the design of a components package is critical and more than just an enclosure.
What you will learn:
-Why IC Packaging is so important to design success
-Overview of the latest IC/SoC packages types and methodologies
-Challenges IC package designers may face and their solutions
-Required features in an IC package design tool
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