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Thermal Interface Materials 101 – Enhanced Cooling for Electronic Systems
Автор: Boyd
Загружено: 2020-02-03
Просмотров: 14709
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Consumer demand is hot for more compact, more powerful electronics. But the denser circuits required for smaller devices generate more heat, making higher performing thermal management materials a necessity. In this webinar, Boyd Corporation and 3M™ will focus on thermal management materials that quickly and efficiently dissipate heat, even within tight spaces.
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