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CEA & Soitec received the 2021 EARTO award
Автор: Soitec
Загружено: 2021-10-28
Просмотров: 978
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CEA received the award in the Impact Delivered category for the development of a patented Smart Cut™ process of substrate fabrication in collaboration with SOITEC, which results in a transfer of a thin active layer of silicon from one substrate to another, which can be used in all electronic devices.
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