UALink 200G 1.0 Specification Overview and Applications
Автор: Ultra Accelerator Link
Загружено: 2025-08-21
Просмотров: 1253
As the demand for AI compute grows, Cloud Service Providers, System OEMs, and IP/Silicon Providers need an efficient, optimized solution to address scale-up AI challenges. The UALink 200G 1.0 Specification defines a low-latency, high-bandwidth interconnect for communication between accelerators and switches in AI computing pods. By increasing performance, improving power and cost efficiency and introducing supply chain diversity and interoperability, UALink enables next-generation AI/ML applications.
During this session, a UALink expert highlighted the technology’s latest advancements and demonstrated how UALink will help create multi-node scale-up systems with enhanced memory semantics for AI applications. Attendees had the opportunity to ask questions about the future applications and benefits of UALink devices.
Speaker: Derek Williams, AMD Fellow, AMD
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