BGA Removal with the IR 1000

In this video we briefly demonstrate the removal of a BGA component from a smart phone circuit board.

To get a quote or obtain more information on the IR 1000, visit the link below:

https://www.paceworldwide.com/product...

"The IR 1000 is a low-cost, remarkably flexible and effective rework system, capable of installing and removing passives, QFP's, SOIC's, PLCC's, MLF's, LCCC's, TSOP's, QFN's and BGA's. IR1000 uses a 500W top Infrared (IR) Heater that does not require heat focusing nozzlesIt is ideal for post assembly rework, repair, and low volume/short run production operations. Economical and easy to use, the IR 1000 delivers high-end functionality, moving far beyond expensive, bulky rework stations by offering unparalleled performance at an affordable price. It does not require heat-focusing nozzles, saving you thousands in additional costs. A microprocessor driven, semi-automated system that does not require an external PC, the IR 1000 allows for simple one zone profiles up to more complicated multi zone profiles and features PACE’s exclusive “Learn Mode” that assists the user with developing profiles. The unit uses a combination of IR top heating coupled with powerful IR bottom heating for an effective, repeatable heating process."