Nvidia's Burning Problem: Why 2027 Tech is Arriving Now
Автор: Sentient Systems
Загружено: 2025-12-05
Просмотров: 6
The sources detail Nvidia's accelerated adoption of Micro-Channel Lid (MCL) technology for its upcoming Vera Rubin (VR200) AI platform, pushing the timeline from 2027 to the fourth quarter of 2026. This strategic shift is driven by a competitive thermal design power (TDP) arms race triggered by AMD’s aggressive 2,500W Instinct MI450X, forcing Nvidia to raise the VR200’s power target to 2,300W, a level that standard liquid cold plates cannot manage. MCLs integrate cooling channels directly into the chip packaging, eliminating the high-resistance thermal interface material (TIM2) layer and significantly increasing thermal dissipation capacity necessary for high-density computing. The reports emphasize that this transition validates the technology and pulls forward revenue for Jentech Precision Industrial, the likely initial supplier, while simultaneously requiring a complete overhaul of data center infrastructure to support the Kyber rack ecosystem’s high-pressure, fully liquid-cooled demands.
Доступные форматы для скачивания:
Скачать видео mp4
-
Информация по загрузке:
![Der Nvidia Lock in [GER]](https://ricktube.ru/thumbnail/QioFocIcPFk/mqdefault.jpg)
