CAMTEK Metrology Innovations Target Advanced Packaging in Chip Manufacturing

CAMTEK Metrology Innovations Target Advanced Packaging in Chip Manufacturing

The growing demand for higher performance semiconductors addressing the new requirements of advanced applications powered by artificial intelligence (AI) is driving the need to innovate equipment technologies required to manufacture such devices.

And as the chip industry looks to More Moore, manufacturers are banking on advanced packaging to pack more power in smaller and smaller device real estate. This increasing complexity requires technologies that will ensure the reliability and performance of these devices.

And this is where Camtek Ltd comes in.

Camtek is a leading manufacturer of metrology and inspection equipment, as well as software solutions, targeting the advanced packaging, memory, CMOS image sensors, MEMS, RF, and other segments in the semiconductor industry, with a focus on artificial intelligence (AI) and high-performance computing (HPC) applications. Camtek systems inspect the external connections of these devices, ensuring they are intact and reliable, before being integrated in a complete HPC module, for instance.

In an interview with EE Times Asia during the recent SEMICON Taiwan 2025 event in Taipei, Rafi Amit, CEO, and Omri Katz, Senior Vice President for Manufacturing and Sales Support at Camtek talk more about Camtek’s role in semiconductor manufacturing, what makes their technologies unique in the market, how they are addressing the increasing demands from chip manufacturers, and where they see the industry is headed.

🎥 Watch the full interview below▶ https://reurl.cc/EQ0M1n

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