Heat transfer simulation of heat source with fins using Comsol
Автор: Jaf-Science
Загружено: 2021-10-18
Просмотров: 22660
This tutorial shows a 3D heat transfer model of a computer chip (heat source) cooled by fins (heat sink). A stationary study with parametric sweep is used to check the effect of increasing fin length on the maximum temperature of the chip.
00:00 Intro
00:20 Geometry
04:41 Materials
06:35 Physics
11:05 Mesh
11:50 Solution
14:15 Results
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