Cool Smarter with Panduit Direct-to-Chip Cooling System
Автор: Panduit
Загружено: 2025-11-17
Просмотров: 234
High Performance Computing generates intense heat, while adding direct-to-chip manifolds creates an overcrowded, error-prone, and complex deployment. The Panduit Direct-to-Chip cooling solution simplifies liquid cooling for AI and HPC servers in high-density deployment environments. Seamless integration with Panduit data center ecosystems allows you to cool smarter and deploy faster.
Cabinets feature
• movable e-rails
• split-hinged doors
• electrically bonded steel frames
Manifolds offer
• leak-free quick connectors
• automatic air exhaust valves
• uniform cooling distribution
Together, they reduce deployment time, minimize installation errors, and support scalable liquid cooling for AI workloads. Address the thermal and spatial challenges of next-gen computing with Panduit Direct-to-Chip cooling.
Visit our website to find out more: https://www.panduit.com/en/solutions/...
#DTC cooling
#Direct-to-chip liquid cooling
#Data center cooling
#Data center heat removal
#Cooling water loop
#Coolant distribution units
#Heat exchanger
#Server room cooling
#Data center thermal management/thermal management
#High-performance computing cooling
#Sustainable cooling solutions
► Panduit LinkedIn: / panduit
► Panduit X: / panduit
Доступные форматы для скачивания:
Скачать видео mp4
-
Информация по загрузке:
