Nintendo Switch Lite - Blue Screen Of Death (BSOD) - Analysis And Repair

The blue screen on Nintendo switch is often caused by board bending which can result from dropping the switch, hitting it or placing an heavy weight object on it. As a result, solder balls on the system become loose, causing a communication issue between the CPU and RAM.

We can fix this error by reballing the SoC chip. Reballing is the process of replacing solder balls on a BGA (Ball Grid Array) chip.
This process is essential when you have the blue screen of death on the Nintendo Switch. Reballing involves removing the original solder balls, aligning the chip with a new set of solder balls, and then reattaching the chip onto mainboard.

▬ Contents of this video ▬▬▬▬▬▬▬▬▬▬

00:00 - Intro
00:26 - Faulth: Blue screen of death
01:09 - Disassembly
02:38 - Remove metal shield
02:52 - Remove heat sink and fan
03:44 - Remove metal heat schield from SoC
05:06 - Test if SoC is the cause of the BSOD
05:39 - Remove fan
06:09 - Remove game card reader
07:27 - Remove mainboard
07:46 - Visual inspection of mainboard
10:42 - Prepare mainboard for SoC removal
12:00 - Setup the pre-heater
12:44 - Set hotair station to +- 180 degrees
13:03 - Set hotair to 410 degrees airflow 50%
13:33 - Remove SoC
14:07 - Ripped pad on the mainboard
14:45 - Lower the melting point on mainboard
15:59 - Remove old solder
22:09 - Remove soldermask of the ripped trace
23:08 - Repair ripped pad and trace
24:19 - Restore the new trace
26:02 - Add solder mask to restored trace and pad
27:59 - Cure the solder mask with UV light
28:10 - Remove excess solder mask
28:32 - Expose the restored pad
29:20 - Tin the soldering pad
30:08 - Test for continuity between pad and trace
30:26 - Remove unleaded solder from the SoC chip
30:48 - Use a stencil to reball the SoC chip
31:00 - Add 0.35mm solder balls
31:57 - Add missing solder balls and check the alignment of all solder balls
33:45 - Reflowing the solder balls with hotair set to 395 degrees and 20% airflow
35:30 - Pad is oxidized, scratch it away and reflow the soldering balls
37:53 - Position SoC on the mainboard and start reflowing
38:10 - Nudge SoC into place with a sharp tweezer
38:21 - Reflow soldering process is complete
38:33 - Reassembling
44:24 - Close metal shield. Don't forget to add thermal paste
44:49 - Add thermal paste
48:26 - Final test