Advanced Packaging Technologies for Multi-Die Integration – Lesson 2

In this video, we explore advanced packaging technologies for multi-die integration. We start with the evolution of packaging, from Multi-Chip Modules (MCM) to cutting-edge 2.5D and 3D designs. Learn about key technologies like silicon interposers, RDL interposers, silicon bridges, and hybrid bonding, along with solutions from leading foundries like TSMC, Samsung, and Intel.
The video also highlights the applications of these technologies in AI, HPC, 5G, mobile devices, and more, while discussing their advantages—such as high performance and small form factors—as well as challenges like thermal management and design complexity. Finally, we introduce multiphysics solutions for analyzing and optimizing these systems, including tools for power integrity, signal integrity, and thermal analysis.

For more details about the contents of this video, visit the lesson page here → TBA

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