eMMC IC REBALLING STEP BY STEP PROCESS || eMMC IC DETAILS || eMMC IC

What is IC reballing?


Reballing means changing all the Soldered Balls on Chip Ball Grid Array Circuit, there are a lot of different reasons why we need to reball a Chip.


How to reball (Using different stencils) -

1. Clean the pads Notice the cold joints on the IC.
2. Clean the surface with contact cleaner and anti-static swabs.
3. Prepare your stencil.
4. Make sure that the IC is centered.
5. Remove any surplus.
6. Use hot air to form the new soldering balls.
7. Clean any residue so that you don't have to clean it again the next time you do a reball.



If you are talking about an IC package, then also yes. Some packages can be removed from the board to be replaced with a new one. To repair the wiring, via-hole, or whatever problem inside a package, is possible but very difficult .


Rebaling means changing all the Soldered Balls on Chip Ball Grid Array Circuit, there are a lot of different reasons why we need to re-ball a Chip




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