Amanda Bryant, Danfoss Power Solutions & Lauren Witter, CoolFlow | SC25

In this interview from SC25, Lauren Witter, vice president of sales at the CoolFlow division of Omni Services, and Amanda Bryant, global product application engineer manager at Danfoss Power Solutions, join theCUBE’s John Furrier and Jackie McGuire to unpack the critical "plumbing layer" of AI infrastructure. As high-density computing drives a massive shift from air to liquid cooling, Witter and Bryant discuss the engineering nuances required to keep pace with rapid chip innovation. They highlight the importance of fluidics, filtration and cleanliness in protecting expensive electronic components from leaks and overheating, emphasizing that the physical infrastructure must scale just as quickly as the silicon roadmaps.

The conversation delves into the operational challenges of managing a global supply chain for physical materials like metals and hoses, contrasting the "wild west" of liquid cooling with established software scaling. Bryant and Witter explain how Danfoss and CoolFlow collaborate to set rigorous testing standards that go beyond OCP baselines to meet hyperscaler demands. They also explore the risks associated with installation labor and the necessity of vetting the entire partner ecosystem to ensure reliability. From raw material forecasting to value-added integration, the discussion reveals how these companies are co-designing systems to prevent bottlenecks and ensure mission-critical uptime.

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00:00 - Intro
00:06 - Foundations and Frameworks: Setting the Stage and Exploring the Plumbing Layer
02:16 - Optimizing Power Solutions and Quality Control in Cooling Systems
05:51 - The Growth and Challenges of Liquid Cooling
08:52 - High-Density Cooling Systems
12:13 - Standards and Testing in the Industry
14:50 - Scaling Success: The Synergy of Supply Chain, Risk Management, and Partnerships

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