China's 3nm DUV Laser Breakthrough Shatters ASML's 20-Year Prediction! Podcast

China's 3nm DUV Laser Breakthrough Shatters ASML's 20-Year Prediction! Podcast
China has achieved a significant breakthrough in semiconductor technology with the development of an all-solid-state DUV laser, enabling the manufacturing of 3-nanometer chips and challenging ASML's dominance. This advancement coincides with a surge in China's chip exports, driven by mature-process technologies that have gained traction in global markets. China's strategic focus on mature chips has generated revenue for advanced R&D, leading to progress in domestic lithography machine development and reduced reliance on foreign technology. The impact of these developments includes a decline in ASML's market share and adjustments within the Taiwanese and South Korean semiconductor industries, signaling a shift in the global semiconductor landscape as China pursues self-sufficiency.
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