Asetek VerticalRackCDU D2C™: Direct-to-Chip, Hot Water Liquid Cooling for Data Centers
Автор: Asetek Inc
Загружено: 2012-11-08
Просмотров: 48926
RackCDU is a warm water, server level, direct-to-chip, data center liquid cooling system that enables cooling energy savings exceeding 50% and density increases of 2.5x when compared to modern air cooled data centers. RackCDU removes heat from CPUs, GPUs, Memory modules and other hot spots within servers and takes it all the way out of the data center using liquid.
Free ambient outdoor air cools the water returning to the data center, meaning no power is used to actively chill the water. The water leaving the data center is hot enough to enable waste heat recycling, enabling further energy cost savings, reductions in carbon foot print and cooling EREs below 1!
RackCDU is deployed at a rack/server level providing maximum scalability. The system consists of a zero-U rack level CDU (Cooling Distribution Unit) mounted in a 10 inch (250mm) rack extension that includes space for 3 additional PDUs, and direct-to-chip cooling loops within each server. The direct-to-chip cooling loops are drop in replacements for the existing air heat sinks, enabling RackCDU deployment as a retrofit, during server refresh cycles and in new builds.
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