How AMD is re-thinking Chiplet Design
Автор: High Yield
Загружено: 2025-09-27
Просмотров: 309218
Strix Halo Chip Deep-dive with a focus on AMD's next-gen die-to-die fan-out interconnect. How AMD is re-imagining Chiplet Design with ZEN 6.
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0:00 Intro
0:44 Strix Halo
2:21 Strix Halo Chip Deep-Dive
5:37 Next-gen ZEN 6 interconnect?
6:34 Strix Halo vs Granit Ridge
7:48 SerDes & Infinity Fabric on Package
11:14 GMI-wide & GMI-narrow
13:48 Next-gen Fan-out die-2-die / TSMC InFO-oS
21:11 Next-gen 3D V-Cache
22:05 From ZEN 2 to ZEN 6
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