3D Circuitry on Thermoplastics

3D molded interconnect devices (MIDs) utilize the best of both mechanical and electrical design - saving space, reducing cost, and increasing reliability. Originally an exclusive technology with high threshold for entry, the demand for MIDs has skyrocketed in recent years as new manufacturing methods have made MID technology available to the masses.

With the ever-present trend towards miniaturization and the need for versatile production options, laser direct structuring (LDS) has been at the forefront of the MID resurgence. LDS is a 3-step process for creating MIDs that makes entering their world a viable option for companies in all industries - from automotive to medical to telecommunications.