Was the phone’s issue “No Service” due to a baseband IC failure?
Автор: MobileSentrix Official
Загружено: 2026-01-06
Просмотров: 290
This video breaks down *stacked iPhone logic board rework* from a practical, shop-level perspective, focusing on the kinds of problems technicians run into during sandwich board separation and reassembly.
It explains how things like *too much heat, rushing the split, damaged pads, incorrect solder ball size, misalignment, or uneven reflow* can quietly ruin inter-board connections. These mistakes often show up later as **No Service issues, baseband communication problems, or phones that work at first and then fail**.
Rather than walking through a single repair, the video focuses on *why these problems happen* and how borderline connections are often mistaken for bad chips. The emphasis is on **clean prep, careful alignment, controlled heat, and letting surface tension do the work instead of forcing boards together**.
This content is meant for *experienced repair shops and technicians* who want fewer comebacks, more consistent results, and a better understanding of what actually causes stacked board failures—without pretending this is an easy or beginner-friendly repair.
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