Mobile Phone IC Replacement | How to remove, reball & install mobile phone main IC SOC Tutorial 32

📱 Welcome to this in-depth and beginner-friendly tutorial on IC replacement in keypad mobile phones!
In this video, I’ll take you through the complete process of removing, reballing, and reinstalling an IC (integrated circuit) on a keypad mobile phone motherboard. If you're a beginner in mobile phone repairing, keypad phones are the perfect place to start practicing IC replacements before moving on to complex smartphones.
💡 This is a must-watch guide for anyone who wants to master basic soldering, IC removal, and reballing techniques using hot air and stencil methods.
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🔧 What You Will Learn in This Video:
✔️ How to safely disassemble a keypad mobile phone
✔️ How to properly remove the IC using hot air and flux
✔️ How to clean PCB pads and IC pads for reinstallation
✔️ How to reball an IC using a stencil and solder paste
✔️ Correct temperature settings and soldering tips
✔️ How to reattach the IC with precise alignment
✔️ Professional tricks to test and verify the repair
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🔍 Step-by-Step Mobile Phone IC Replacement Guide:
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🔹 1. Disassemble the Mobile Phone
• Begin by powering off the device and removing the battery.
• Unscrew and carefully open the phone's casing.
• Take out the PCB (mainboard) and place it on a mobile PCB holder to stabilize it during the work.
✅ Tip: Always work in a clean, static-free environment for safety and precision.
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🔹 2. Apply Flux on the IC Area
• Use high-quality flux like Amtech RMA-223 or UV559 for better heat transfer and clean removal.
• Apply flux only from one side to prevent overspreading and protect surrounding components.
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🔹 3. Remove the IC Using Hot Air
• Set your hot air station to 350–380°C depending on the IC and PCB type.
• Gently heat the IC using circular motions until the solder melts.
• Use precision tweezers to lift the IC from the board once loosened.
⚠️ Warning: Never force the IC off the board or you risk tearing off the pads.
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🔹 4. Clean the PCB Pads
• Use a desoldering braid/wick (about 1 inch in size) to absorb all remaining solder from the IC pad area.
• Set your soldering iron to 400°C and slowly drag the wick across the pads using tweezers.
• After removing solder, clean the pads using IPA (isopropyl alcohol) and a soft brush or cotton swab.
✅ Make sure no solder, dirt, black marks, or yellow stains are left on the pads.
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🔹 5. Clean the IC Bottom Pads
• Repeat the same cleaning process on the removed IC:
o Use a solder wick to remove any leftover solder.
o Use IPA and brush to clean off old flux.
o If needed, gently scratch dirt from pads using a pen-type blade (very carefully).
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🔹 6. Prepare the IC for Reballing
• Take your BGA stencil and place the IC under it.
• Secure it in place using adhesive tape to prevent movement during reballing.
🧪 Now comes the most delicate part – applying fresh solder balls to the IC.
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🔹 7. Apply Solder Paste and Reball the IC
• Take some 183°C solder paste, and remove excess flux by:
o Placing it on tissue paper folded in two.
o Press lightly 3–4 times to absorb extra flux, so the paste becomes drier and easier to work with.
• Apply the paste on the stencil using a blade or plastic spreader.
• Fill all holes evenly and wipe off excess solder from stencil.
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🔹 8. Heat the Solder Paste to Form Balls
• Hold the stencil tightly with tweezers.
• Use 280°C hot air and gently heat the solder from one side.
• Do not overheat or stay in one place for too long, or the paste will boil and flow out of holes.
• Use a side-to-side sweeping motion until all balls form.
🔥 After 10–12 seconds, apply flux again and heat one more time for strong and even balls.
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🔹 9. Clean and Prepare for Reinstallation
• Let the IC cool down, then carefully remove it from the stencil.
• Clean it with IPA and a soft brush again to remove any leftover flux.
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🔹 10. Reattach the IC on the Motherboard
• Apply UV559 flux on the cleaned PCB pads.
• Place the IC in its exact position on the board – alignment is critical!
• Heat the area with hot air at 350°C using small circular motion.
🎯 You’ll notice the IC auto-aligns itself slightly once the solder balls start melting — that’s a good sign!
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🔹 11. Final Touch & Testing
• Gently nudge the IC from the corner with tweezers to confirm it's attached properly.
• Let the board cool and test the phone:
o If the phone powers on, your repair was successful!
o If not, you may need to reheat or reflow again.
• Once tested, clean the area thoroughly with IPA and reassemble the mobile phone.