Intel Accelerated: Introducing New RibbonFET and PowerVia Technologies

▶ Learn more about Intel's Process and Packaging Innovations: https://intel.ly/3GonMP1

At its "Intel Accelerated" event on July 26, 2021, Intel introduced #RibbonFET, its first new transistor architecture in more than a decade, and #PowerVia, an industry-first new backside power delivery method. RibbonFET, Intel’s implementation of a gate-all-around transistor, will be the company’s first new transistor architecture since it pioneered FinFET. The #technology delivers faster transistor switching speeds while achieving the same drive current as multiple fins in a smaller footprint. PowerVia is Intel’s unique industry-first implementation of backside power delivery, optimizing signal transmission by eliminating the need for power routing on the front side of the wafer.
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▶ Learn more from #IntelAccelerated: https://intel.ly/31KZijL

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