PCB Design: Top Factors Related to Data Routing and Layout

When it comes to PCB design and layout, the decisions made early in your project can significantly impact not only the functionality of your circuit board but also its manufacturability, cost, and lead time. Understanding these critical considerations helps ensure a seamless transition from design to production while avoiding costly errors or delays.

Key factors to address include material selection, maximum board thickness, layer count, and whether to incorporate advanced features like blind and buried vias.

Additionally, considerations around copper weights, trace widths and spacing, balanced copper distribution, and overall design complexity can heavily influence both manufacturability and reliability.

A crucial question is: When should you involve your PCB provider in the design process? Engaging early can help identify potential roadblocks, ensure design-for-manufacturing (DFM) compatibility, and optimize your layout for efficient production.

In this webinar, we take a deep dive into PCB designs as they relate to manufacturing. Whether you’re developing a simple two-layer board or a complex multilayer design, this session will provide actionable insights to streamline your process and achieve the best results for your project.

For more information on our PCB solutions, visit https://www.epectec.com/pcb.