i2C DL 03, Professional iPhone battery Dot Welder

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Through-hole Pad

Through-hole pads are utilized for mounting through-hole components on a circuit board. These pads feature via holes where the pins of the components are inserted during the PCB soldering process. By soldering components via through-hole pads, durable solder joints are established, ensuring a dependable long-term mechanical and electrical connection to the PCB. However, it’s important to note that due to the presence of component leads and the necessary holes, the availability of routing space on a multilayer PCB may be restricted.
Surface Mount Pad

Surface mount pads are used for mounting electronic components directly onto the surface of a circuit board. Unlike through-hole pads, which require the components to pass through holes in the board, surface mount pads are designed for smaller components that can be soldered directly to the board’s surface. Surface mount pads offer several advantages. They enable a higher component density, allowing more components to be placed in a smaller space on the board. This compact arrangement enhances the functionality and performance of the circuit. Additionally, surface mount pads are particularly beneficial for the design of complex multi-layer boards, where space optimization is critical. However, it’s important to note that surface mount pads may not be suitable for components that generate significant amounts of heat. The compact nature of surface mount technology may restrict the dissipation of heat, potentially leading to overheating issues.