Ion beam trimming of piezoelectric materials

Ion beam trimming is a special ion beam milling process, where a focused ion beam scans across the wafer. The local material removal is controlled by adjusting the dwell time. In his video presentation, our sales director Marcel Demmler introduces the ion beam trimming process and our process solution scia Trim 200, which can significantly improve the manufacturing yield of piezoelectric devices. He follows up by showing you two application examples including process results.


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About scia Systems
The company was founded 2013 and is located in Chemnitz, Germany. As manufacturer of precise surface processing equipment, based on advanced ion beam and plasma technologies, scia Systems established itself in a very short time on the worldwide market. Our customers are companies and research institutes, mainly in the field of microelectronics, MEMS, and precision optics manufacturing.

scia Systems stands for highly reliable equipment to meet expectations for today and the future. To ensure our high standards, we work closely with our customers to optimize tool performance and meet the future roadmap requirements.