Expert Session: Integrated Glass-Based Electro-Optical Platform for Co-Packaging
Автор: Fraunhofer IZM
Загружено: 2021-02-03
Просмотров: 1240
#2 Expert Session of Series »IZM Photonics: IN GLASS WE TRUST«
Speaker: Oliver Kirsch, Fraunhofer IZM
Latest trends in system integration and packaging are strongly aiming at heterogeneous, hybrid integration solutions such as co-packaging of electronics and optics and disaggregated system on-chip. In this webinar we will present a glass-based platform suitable for these integration strategies and show how our approach allows for a cost reduction compared to other material platforms (such as Si or SiN) as it is based on low-cost display glass which is available in large panel sizes (of up to 457 x 303 mm²) and commercial manufacturing equipment enabling high scalability.
#photonics #microelectronics
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